CuClad®系列层压板

Rogers CuClad laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications. CuClad laminates feature low dielectric constants (Dk) ranging from 2.17 to 2.60，低电损耗tan δ从0.0009 to 0.0018 at X-band and low moisture absorption. These balanced, cross plied constructed laminates are available up to 36” x 48” in size.

好处

在宽频率范围内稳定的Dk
适用于宽带应用
Provide higher gain in amplifier and antenna designs
First article success leaders to faster time to market
Sheet sizes accommodate larger PCB or radome formats

PG电子平台

CuClad®217层压板

Dk (2).17 or 2.20
Uses a low fiberglass/PTFE ratio to provide lowest Dk and dissipation factor available in its class

CuClad®233层压板

Dk (2).33
Uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties

CuClad®250层压板

Dk (2).40 to 2.60
Uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates

CuClad®6250粘接膜

Dk或2.32
Ethylene-acrylic acid thermoplastic copolymer bonding film

CuClad®6700粘接膜

Dk (2).35
Chloro-trifluoroethylene (CTFE) thermoplastic copolymer bonding film

应用程序

View current applications of this product line.

天线系统

天线系统

通信
系统

通信系统

Handheld Device Cellular and Wifi Antenna

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High Frequency Electronics Product Selector Guide

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